Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right
Email/Printer Friendly Format  
 

Effect of thermal annealing on radiation-induced degradation of bipolar technologies when the dose rate is switched from high to low
Ducret, S.   Saigne, F.   Boch, J.   Schrimpf, R.D.   Fleetwood, D.M.   Vaille, J.R.   Dusseau, L.   David, J.P.   Ecoffet, R.  
Univ. de Montpellier, France;

This paper appears in: Nuclear Science, IEEE Transactions on
Publication Date: Dec. 2004
Volume: 51,  Issue: 6, Part 2
On page(s): 3219- 3224
ISSN: 0018-9499
INSPEC Accession Number: 8225468
Digital Object Identifier: 10.1109/TNS.2004.839145
Current Version Published: 2004-12-20

Abstract
The influence of an electrostatic barrier in the oxide bulk on the radiation-induced degradation of bipolar technologies is investigated by performing a thermal annealing operation before switching the dose rate from high to low. It is shown that, in our test conditions, no significant electrostatic barrier effect is at play in the device degradation.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (224 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved