Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right
Email/Printer Friendly Format  
 

Elevated temperature irradiation at high dose rate of commercial linear bipolar ICs
Boch, J.   Saigne, F.   Schrimpf, R.D.   Fleetwood, D.M.   Cizmarik, R.   Zander, D.  
Univ. de Reims, France;

This paper appears in: Nuclear Science, IEEE Transactions on
Publication Date: Oct. 2004
Volume: 51,  Issue: 5, Part 3
On page(s): 2903- 2907
ISSN: 0018-9499
INSPEC Accession Number: 8155379
Digital Object Identifier: 10.1109/TNS.2004.835055
Current Version Published: 2004-10-18

Abstract
The effect of high temperature irradiations has been investigated on four types of commercial linear bipolar integrated circuits (ICs) at eight temperatures ranging from 25°C to 150°C for different total doses at a given dose rate. In agreement with results obtained for individual bipolar transistors, the results show that an optimum irradiation temperature exists that leads to a maximum amount of degradation. Results are compared to low dose rate (LDR) irradiations for ICs with npn and pnp input transistors.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (240 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved