Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right
Email/Printer Friendly Format  
 

SPICE Modeling for Small Geometry MOSFET Circuits
Ping Yang   Chatterjee, P.K.  

This paper appears in: Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publication Date: October 1982
Volume: 1,  Issue: 4
On page(s): 169- 182
ISSN: 0278-0070
Current Version Published: 2004-03-03

Abstract
VLSI circuit simulation requires computationally efficient MOSFET models. In this paper, VLSI circuit simulator models for the active device and some important passive devices are described. A quasi-physical short channel MOSFET current model is derived. This current model contains both above-threshold and subthreshold components. The values of the model parameter are extracted automatically from measured I-V data. The reduction in process information in this representation is shown to be tolerable using a proper quantization of the geometry and device type space. Narrow width effect is also included. A charge conserving MOSFET capacitor model is also given. The importance of the parasitic devices on VLSI circuit is shown and a model for the fringing capacitance due to finite gate thickness is introduced. A "process box" based on the statistical variation of parameters is extracted from a completely automated device characterization system. Experimental results indicate that the width and length are independent random variables. This statistical information allows the circuit response to be simulated across the process window.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (1912 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved