Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

UHF micromechanical extensional wine-glass mode ring resonators
Yuan Xie   Sheng-Shian Li   Yu-Wei Lin   Zeying Ren   Nguyen, C.T.C.  
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA;

This paper appears in: Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Publication Date: 8-10 Dec. 2003
On page(s): 39.2.1- 39.2.4
ISSN:
ISBN: 0-7803-7872-5
INSPEC Accession Number: 7862402
Digital Object Identifier: 10.1109/IEDM.2003.1269436
Current Version Published: 2004-03-03

Abstract
Vibrating polysilicon micromechanical ring resonators, utilizing a unique extensional wine-glass mode shape to achieve lower impedance than previous UHF resonators, have been demonstrated at frequencies as high as 1.2-GHz with a Q of 3,700, and 1.47-GHz (highest to date) with a Q of 2,300. The 1.2-GHz resonator exhibits a measured motional resistance of 560 kΩ with a dc-bias voltage of 20 V, which is 6× lower than measured on radial contour mode disk counterparts at the same frequency, and which can be driven down as low as 2 kΩ when a dc-bias voltage of 100 V and electrode-to-resonator gap spacing of 460 Å are used. The above high Q and low impedance advantages, together with the multiple frequency, on-chip integration advantages afforded by electrostatically-transduced μmechanical resonators, make this device an attractive candidate for use in the front-end RF filtering and oscillator functions needed by wireless communication devices.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (480 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved