Micro thermal management of high-power diode laser bars
Lorenzen, D.
Bonhaus, J.
Fahrner, W.R.
Kaulfersch, E.
Worner, E.
Koidl, P.
Unger, K.
Muller, D.
Rolke, S.
Schmidt, H.
Grellmann, M.
Jenoptik Laserdiode GmbH, Jena;
This paper appears in: Industrial Electronics, IEEE Transactions on
Publication Date: Apr 2001
Volume: 48,
Issue: 2
On page(s): 286-297
ISSN: 0278-0046
References Cited: 14
CODEN: ITIED6
INSPEC Accession Number: 6895156
Digital Object Identifier: 10.1109/41.915407
Current Version Published: 2002-08-07
Abstract
Lifetime and reliability of high-power diode laser bars are
sensitively related to operating temperature, mounting stress, and
solder electromigration. These three factors have been taken into
account for the development of a new packaging technology for 1 cm laser
bars of gallium arsenide. We examine the use of chemical-vapor-deposited
(CVD) diamond as heatspreaders in order to reduce thermal resistance of
a microchannel cooler for liquid cooling. We show that it is possible to
perform hard soldering on a CVD-diamond with a new technique.
Additionally, we present a controlled water cooling system fit to the
flow characteristics of the cooler. It permits one to adjust the
emission wavelength of the diode lasers by changing the water flux
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