An integrated micro cooling system for electronic circuits
Schutze, J.
Ilgen, H.
Fahrner, W.R.
ILFA GmbH, Kesseisdorf;
This paper appears in: Industrial Electronics, IEEE Transactions on
Publication Date: Apr 2001
Volume: 48,
Issue: 2
On page(s): 281-285
ISSN: 0278-0046
References Cited: 6
CODEN: ITIED6
INSPEC Accession Number: 6895155
Digital Object Identifier: 10.1109/41.915406
Current Version Published: 2002-08-07
Abstract
A fully FR4-compatible integrated cooling system has been
developed. Cooling channels have been etched into a thick copper layer
to form microchannels. The structure is reinforced by two prepreg layers
toward the component and solder side. Several cooling channels can be
independently run. The heat dissipation capability of the system is 20 W
per channel (and heat source). Typical coolants are water or
methoxynonafluorobutane. For an outlet to inlet temperature difference
of 25°C and a power dissipation of 30 W, a (water) flow rate of 20
ml/min is required. Pressure losses are below 300 mbar (for water)
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