Review on materials, microsensors, systems and devices forhigh-temperature and harsh-environment applications
Werner, M.R.
Fahrner, W.R.
Microtechnol. Innovation Team, Deutsche Bank AG, Berlin;
This paper appears in: Industrial Electronics, IEEE Transactions on
Publication Date: Apr 2001
Volume: 48,
Issue: 2
On page(s): 249-257
ISSN: 0278-0046
References Cited: 19
CODEN: ITIED6
INSPEC Accession Number: 6895151
Digital Object Identifier: 10.1109/41.915402
Current Version Published: 2002-08-07
Abstract
The considerable investment in silicon technology has rarely
addressed device use in harsh environments such as high temperatures,
aggressive media, and radiation exposure. A clear future requirement is
to save weight, volume, and reduce costs in “unfriendly”
environments like high temperatures. This can be achieved either by
cooling systems or by electronic microsystem components suited to
withstand high temperatures. The current status of cooling systems,
harsh-environment sensors, and microsystems in view of markets, realized
devices, material, properties, process maturity, and packaging
technologies are reviewed. Possible semiconductor candidates for
high-temperature applications are discussed. The main obstacles for the
future of high-temperature and harsh-environment microsystems is
highlighted
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