Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Hyperpatches for 3D model acquisition and tracking
Wiles, C.S.   Maki, A.   Matsuda, N.  
Ealing Studios, Anthropics Technol., London;

This paper appears in: Pattern Analysis and Machine Intelligence, IEEE Transactions on
Publication Date: Dec 2001
Volume: 23,  Issue: 12
On page(s): 1391-1403
ISSN: 0162-8828
References Cited: 21
CODEN: ITPIDJ
INSPEC Accession Number: 7165072
Digital Object Identifier: 10.1109/34.977563
Current Version Published: 2002-08-06

Abstract
Automatic 3D model acquisition and 3D tracking of simple objects under motion using a single camera is often difficult due to the sparsity of information from which to establish the model. We developed an automatic scheme that first computes a simple Euclidean model of the object and then enriches this model using hyperpatches. These hyperpatches contain information on both the orientation and intensity pattern variation of roughly planar patches on an object. This information allows both the spatial and intensity distortions of the projected patch to be modeled accurately under 3D object motion. Considering human tracking as a specific application, we show that hyperpatches can not only be computed automatically during model acquisition from a monocular image sequence, but that they are also extremely appropriate for the task of visual tracking

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (2136 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved