Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Fast surface interpolation using hierarchical basis functions
Szeliski, R.  
Digital Equipment Corp., Cambridge, MA;

This paper appears in: Pattern Analysis and Machine Intelligence, IEEE Transactions on
Publication Date: Jun 1990
Volume: 12,  Issue: 6
On page(s): 513-528
ISSN: 0162-8828
References Cited: 45
CODEN: ITPIDJ
INSPEC Accession Number: 3724660
Digital Object Identifier: 10.1109/34.56188
Current Version Published: 2002-08-06

Abstract
An alternative to multigrid relaxation that is much easier to implement and more generally applicable is presented. Conjugate gradient descent is used in conjunction with a hierarchical (multiresolution) set of basis functions. The resultant algorithm uses a pyramid to smooth the residual vector before the direction is computed. Simulation results showing the speed of convergence and its dependence on the choice of interpolator, the number of smoothing levels, and other factors are presented. The relationship of this approach to other multiresolution relaxation and representation schemes is also discussed

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (1324 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved