Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Convolution on mesh connected multicomputers
Ranka, S.   Sahni, S.  
Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN;

This paper appears in: Pattern Analysis and Machine Intelligence, IEEE Transactions on
Publication Date: Mar 1990
Volume: 12,  Issue: 3
On page(s): 315-318
ISSN: 0162-8828
References Cited: 14
CODEN: ITPIDJ
INSPEC Accession Number: 3641643
Digital Object Identifier: 10.1109/34.49056
Current Version Published: 2002-08-06

Abstract
An efficient parallel algorithm is presented for convolution on a mesh-connected computer with wraparound. The algorithm does not require a broadcast feature for data values, as assumed by previously proposed algorithms. As a result, the algorithm is applicable to both SIMD and MIMD meshes. For an N×N image and a M×M template, the previous algorithms take O (M2q) time on an N×N mesh-connected multicomputer (q is the number of bits in each entry of the convolution matrix). The algorithms have complexity O(M2r), where r=max {number of bits in an image entry, number of bits in a template entry}. In addition to not requiring a broadcast capability, these algorithms are faster for binary images

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (300 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved