Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Efficient image warping and super-resolution
Ming-Chao Chiang   Boult, T.E.  
Dept. of Comput. Sci., Columbia Univ., New York, NY;

This paper appears in: Applications of Computer Vision, 1996. WACV '96., Proceedings 3rd IEEE Workshop on
Publication Date: 2-4 Dec 1996
On page(s): 56-61
Meeting Date: 12/02/1996 - 12/04/1996
Location: Sarasota, FL, USA
ISBN: 0-8186-7620-5
References Cited: 12
INSPEC Accession Number: 5485088
Digital Object Identifier: 10.1109/ACV.1996.572000
Current Version Published: 2002-08-06

Abstract
This paper introduces a new algorithm for enhancing image resolution from an image sequence. The approach we propose herein uses the integrating resampler proposed by M. Chiang and T. Boult (1996) as the underlying resampling algorithm. Moreover, it is a direct method, which is fundamentally different from the iterative, back-projection approaches proposed in previous work. We show that image warping techniques may have a strong impact on the quality of image resolution enhancement. By coupling the degradation model of the imaging system directly into the integrating resampler, we can better approximate the warping characteristics of real sensors, which also highly improve the quality of super-resolution images. Examples of super-resolutions are given for gray-scale images. Evaluations are made by comparing the resulting images and those using bi-linear resampling and back-projection. Results from our experiments show that integrating resampler outperforms traditional bi-linear resampling

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (752 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved