Specular spectroscopic scatterometry
Xinhui Niu
Jakatdar, N.
Junwei Bao
Spanos, C.J.
Dept. of Electr. Eng., California Univ., Berkeley, CA;
This paper appears in: Semiconductor Manufacturing, IEEE Transactions on
Publication Date: May 2001
Volume: 14,
Issue: 2
On page(s): 97-111
ISSN: 0894-6507
References Cited: 32
CODEN: ITSMED
INSPEC Accession Number: 6928834
Digital Object Identifier: 10.1109/66.920722
Current Version Published: 2002-08-07
Abstract
Scatterometry is one of the few metrology candidates that has true
in situ/in-line potential for deep submicrometer critical dimension (CD)
and profile analysis. Most existing scatterometers are designed to
measure multiple incident angles at a single wavelength on periodic
gratings. We extend this idea by deploying specular spectroscopic
scatterometry. Specular spectroscopic scatterometry (SS) is designed to
measure the zeroth-order diffraction response at a fixed angle of
incidence and multiple wavelengths. This mechanism allows the use of
existing thin-film metrology equipment, such as spectroscopic
ellipsometers, to accurately extract topographic profile information
from one-dimensional (1-D) periodic structures. In this work, we
developed the grating tool-kit (gtk), which implements several variants
of rigorous coupled-wave analysis (RCWA) to accurately and efficiently
simulate diffraction behavior of 1-D gratings. Theoretical simulations
using this package show that specular spectroscopic scatterometry can be
applied in the current semiconductor manufacturing technology, and can
be easily extended to the 0.07-μm generation. We have also applied a
library-based profile extraction methodology to resist and poly
focus-exposure matrices patterned using 0.25and 0.18-μm lithography
and etch technology, respectively, to extract their cross-sectional
profiles. Discrepancies between CD-SEM, CD-AFM, and SSS measurements are
discussed and explained
Index
Terms
Available to subscribers and IEEE members.
References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
Cart
