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Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips | IEEE Conference Publication | IEEE Xplore

Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips


Abstract:

We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon c...Show More

Abstract:

We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.
Date of Conference: 20-24 March 2016
Date Added to IEEE Xplore: 11 August 2016
ISBN Information:
Conference Location: Anaheim, CA, USA

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