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Effects of wet oxidation/anneal on interface properties of thermally oxidized SiO/sub 2//SiC MOS system and MOSFET's | IEEE Journals & Magazine | IEEE Xplore

Effects of wet oxidation/anneal on interface properties of thermally oxidized SiO/sub 2//SiC MOS system and MOSFET's


Abstract:

Effects of wet atmosphere during oxidation and anneal on thermally oxidized p-type and n-type MOS interface properties were systematically investigated for both 4H- and 6...Show More

Abstract:

Effects of wet atmosphere during oxidation and anneal on thermally oxidized p-type and n-type MOS interface properties were systematically investigated for both 4H- and 6H-SiC. Deep interface states and fixed oxide charges were mainly discussed. The wet atmosphere was effective to reduce a negative flatband shift caused by deep donor-type interface states in p-type SiC MOS capacitors. Negative fixed charges, however, appeared near the interface during wet reoxidation anneal. In n-type SIC MOS capacitors, the flatband shift indicated a positive value when using wet atmosphere. The relation between interface properties and characteristics of n-channel planar 6H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs) was also investigated. There was little relation between the interface properties of p-type MOS capacitors and the channel mobility of MOSFETs. The threshold voltage of MOSFETs processed by wet reoxidation anneal was higher than that of without reoxidation anneal. A clear relation between the threshold voltage and the channel mobility was observed in MOSFETs fabricated on the same substrate.
Published in: IEEE Transactions on Electron Devices ( Volume: 46, Issue: 3, March 1999)
Page(s): 504 - 510
Date of Publication: 31 March 1999

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