Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Plasma diagnosis with Langmuir probe in the process of vacuum arcdeposition
Zhong-Yuan Cheng   Ji-Yan Zou   Lei Yang  
Dept. of Electr. Eng., Huazhong Univ. of Sci. & Technol., Hubei;

This paper appears in: Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
Publication Date: 21-26 Jul 1996
Volume: 2,  On page(s): 858-862 vol.2
Meeting Date: 07/21/1996 - 07/26/1996
Location: Berkeley, CA, USA
ISBN: 0-7803-2906-6
References Cited: 16
INSPEC Accession Number: 5490217
Digital Object Identifier: 10.1109/DEIV.1996.545484
Current Version Published: 2002-08-06

Abstract
This paper introduces some efforts to use the Langmuir probe as an in situ diagnostic tool in the process of VAD (vacuum arc deposition), i.e., to minimize the contamination on the probe and to discuss the validity of the probe theories. The characteristic curves are dealt with by Langmuir's thick-sheath model, and the plasma parameters (electron temperature kTe and electron density n0) are calculated from the combination of the Ie2~V curves and LnIe~V curves. Plasma diagnoses are performed in the process of TiN film deposition, with different partial pressures of nitrogen, arc current and distances from the cathode. Nonelastic collisions in the VAD plasma are evaluated with the diagnostic results

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (444 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved