3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
Jian-Qiang Lu
Dept. of Electr., Comput., & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY;
This paper appears in: Proceedings of the IEEE
Publication Date: Jan. 2009
Volume: 97,
Issue: 1
On page(s): 18-30
ISSN: 0018-9219
INSPEC Accession Number: 10501033
Digital Object Identifier: 10.1109/JPROC.2008.2007458
Current Version Published: 2009-02-27
Abstract
Three-dimensional (3-D) hyperintegration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro-nano systems. This 3-D hyperintegration is expected to lead to an industry paradigm shift due to its tremendous benefits. Worldwide academic and industrial research activities currently focus on technology innovations, simulation and design, and product prototypes. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of InfoTech-NanoTech-BioTech systems. This paper overviews the 3-D hyperintegration and packaging technologies, including motivations, key technology platforms, status, and perspectives towards commercialization. The challenges associated with the 3-D technologies are addressed, including integration architectures and design tools, yield and cost, thermal and mechanical constraints, and manufacturing infrastructure.
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