Low-Power Design and Temperature Management
Skadron, K.
Bose, P.
Ghose, K.
Sendag, R.
Yi, J.J.
Chiou, D.
Virginia Univ., Charlottesville;
This paper appears in: Micro, IEEE
Publication Date: Nov.-Dec. 2007
Volume: 27,
Issue: 6
On page(s): 46-57
ISSN: 0272-1732
INSPEC Accession Number: 9901210
Digital Object Identifier: 10.1109/MM.2007.104
Current Version Published: 2008-01-22
Abstract
One of the primary concerns for microprocessor designers has always been balancing power and thermal management while minimizing performance loss. rather than generate solutions to this dilemma, the advent of multicore chips has raised a host of new challenges. this discussion with Pradip Bose and Kanad Ghose, excerpted from a 2007 Card Workshop Panel, explores the future of low-power design and temperature management.
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