Assembly Problems in Lead-free and Mix Production

Some electronic assemblers are faced to face with the necessity to use heterogeneous assembly of both very large and very small components on the same board and mix tin-lead and lead free soldering technology. Authors try to solve the problems with pick and place very small components by special design of stencil and adjust printing and assembly parameters. The solution of the soldering problems they try to solve by optimization the soldering profiles for mix technology.