Semiconductor yield improvement: results and best practices
Cunningham, S.P.
Spanos, C.J.
Voros, K.
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA;
This paper appears in: Semiconductor Manufacturing, IEEE Transactions on
Publication Date: May 1995
Volume: 8,
Issue: 2
On page(s): 103-109
ISSN: 0894-6507
References Cited: 2
CODEN: ITSMED
INSPEC Accession Number: 4965182
Digital Object Identifier: 10.1109/66.382273
Current Version Published: 2002-08-06
Abstract
The results of a world-wide study on yield improvement are
presented. Die yields collected from 21 fabs are transformed via a logit
formula and compared. The die yields and die yield improvement rates of
the fabs are compared, and manufacturing yield improvement practices are
evaluated. Preliminary results of this continuing study indicate that
die yield improvement is a function of computer-aided manufacturing
practices and statistical process control practices in addition to
commonly cited practices such as particle control and advanced
manufacturing technology
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