Embedding Mixed-Signal Design in Systems-on-Chip
Rabaey, J.M.
De Bernardinis, F.
Niknejad, A.M.
Nikolic, B.
Sangiovanni-Vincentelli, A.
California Univ., Berkeley, CA, USA;
This paper appears in: Proceedings of the IEEE
Publication Date: June 2006
Volume: 94,
Issue: 6
On page(s): 1070-1088
ISSN: 0018-9219
INSPEC Accession Number: 8985243
Digital Object Identifier: 10.1109/JPROC.2006.873609
Current Version Published: 2006-07-10
Abstract
With semiconductor technology feature size scaling below 100 nm, mixed-signal design faces some important challenges, caused among others by reduced supply voltages, process variation, and declining intrinsic device gains. Addressing these challenges requires innovative solutions, at the technology, circuit, architecture, and design-methodology level. We present some of these solutions, including a structured platform-based design methodology to enable a meaningful exploration of the broad design space and to classify potential solutions in terms of the relevant metrics.
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