Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor
Klink, G.
Hammerl, E.
Drost, A.
Hemmetzberger, D.
Bock, K.
Fraunhofer Institute for Reliability and Microintegration, Hansastraße 27d, D-80686 Munich, Germany, phone +49 89 54759-595, fax +49 89 54759 550, gerhard.klink@izm-m.fraunhofer.de;
Abstract
Rapid progress in the field of organic semiconductors makes the vision of plastic integrated circuits reachable. Polymer electronic is expected to be a promising technology for low-cost and large-area electronic systems, which can not be addressed by traditional chip technology. Solutions of polymer or polymer based pastes offer advantages due to their easy processing possibilities which give the opportunity to coat and pattern them like a printing ink. Cost requirements of polymer electronic imply that for manufacturing also very cost-effective processes must be used. Hence reel-to-reel manufacturing with endless substrates of foil is a key technology to fulfill the challenging cost demands of cheap flexible systems. Within this work a process for manufacturing integrated circuits based on solution processed polymer semiconductors has been developed. Basis is a reel-to-reel working photolithographic patterning process for metallized foils, which is used to fabricate the basic source-drain layer with high resolution. By two subsequent lacquering and three screen printing steps polymer field effect transistors are integrated to circuits.
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