Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Large Area Electronics Using Printing Methods
Parashkov, R.   Becker, E.   Riedl, T.   Johannes, H.-H.   Kowalsky, W.  
Inst. for High-Frequency Eng., Tech. Univ. of Braunschweig, Germany;

This paper appears in: Proceedings of the IEEE
Publication Date: July 2005
Volume: 93,  Issue: 7
On page(s): 1321-1329
ISSN: 0018-9219
INSPEC Accession Number: 8604046
Digital Object Identifier: 10.1109/JPROC.2005.850304
Current Version Published: 2005-07-05

Abstract
After the demonstration of the first organic FET in 1986, a new era in the field of electronic began: the era of organic electronics. Although the reported performance of organic transistors is still considerably lower compared to that of silicon transistors, a new market is open for organic devices, where the excellent performance of silicon technology is not required. Several commercial applications for organic electronics have been suggested: organic RFID tags, electronic papers, imagers, sensors, organic LED drivers, etc. The main advantage of organic technologies over silicon technologies is the possibility of making low-cost, large area electronics. The main processes which allow patterning with suitable resolution on a large areas are printing methods. Here we will provide an overview of methods that can be useful in the low-cost production of large area electronics.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (553 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved