Temperature-aware computer systems: Opportunities and challenges
Skadron, K.
Stan, M.R.
Wei Huang
Velusamy, S.
Sankaranarayanan, K.
Tarjan, D.
Virginia Univ., Charlottesville, VA, USA;
This paper appears in: Micro, IEEE
Publication Date: Nov.-Dec. 2003
Volume: 23,
Issue: 6
On page(s): 52- 61
ISSN: 0272-1732
INSPEC Accession Number: 7907630
Digital Object Identifier: 10.1109/MM.2003.1261387
Current Version Published: 2004-01-21
Abstract
Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. The authors define the role of architecture techniques and describe hotspot, an accurate yet fast thermal model suitable for computer architecture research.
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