Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Construction of irregular LDPC codes with low error floors
Tao Tian   Jones, C.   Villasenor, J.D.   Wesel, R.D.  
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA;

This paper appears in: Communications, 2003. ICC '03. IEEE International Conference on
Publication Date: 11-15 May 2003
Volume: 5,  On page(s): 3125- 3129 vol.5
ISBN: 0-7803-7802-4
INSPEC Accession Number: 7906140
Digital Object Identifier: 10.1109/ICC.2003.1203996
Current Version Published: 2003-06-11

Abstract
This work explains the relationship between cycles, stopping sets, and dependent columns of the parity check matrix of low-density parity-check (LDPC) codes. Furthermore, it discusses how these structures limit LDPC code performance under belief propagation decoding. A new metric called extrinsic message degree (EMD) measures cycle connectivity in bipartite graph. Using an easily computed estimate of EMD, we propose a Viterbi-like algorithm that selectively avoids cycles and increases stopping set size. This algorithm yields codes with error floors that are orders of magnitude below those of girth-conditional codes.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (342 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved