Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Finite-length analysis of low-density parity-check codes on thebinary erasure channel
Changyan Di   Proietti, D.   Telatar, I.E.   Richardson, T.J.   Urbanke, R.L.  
Swiss Fed. Inst. of Technol., Lausanne;

This paper appears in: Information Theory, IEEE Transactions on
Publication Date: Jun 2002
Volume: 48,  Issue: 6
On page(s): 1570-1579
ISSN: 0018-9448
References Cited: 16
CODEN: IETTAW
INSPEC Accession Number: 7297389
Digital Object Identifier: 10.1109/TIT.2002.1003839
Current Version Published: 2002-08-07

Abstract
In this paper, we are concerned with the finite-length analysis of low-density parity-check (LDPC) codes when used over the binary erasure channel (BEC). The main result is an expression for the exact average bit and block erasure probability for a given regular ensemble of LDPC codes when decoded iteratively. We also give expressions for upper bounds on the average bit and block erasure probability for regular LDPC ensembles and the standard random ensemble under maximum-likelihood (ML) decoding. Finally, we present what we consider to be the most important open problems in this area

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (463 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved