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Advanced Electronic Packaging

Cover Image Copyright Year: 2006
Author(s): Ulrich, R.; Brown, W.
Publisher: Wiley-IEEE Press
Content Type : Books & eBooks
Topics: Components, Circuits, Devices & Systems ;  Engineered Materials, Dielectrics & Plasmas ;  Fields, Waves & Electromagnetics
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Abstract

Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
Packaging materials and applications
Modeling and simulations
Analytical techniques for materials
MEMS packaging
Fabrication technologies and package design
Reliability
Electrical, mechanical, and thermal considerations
Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.

  •   Click to expandTable of Contents

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      Frontmatter

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.fmatter
      Page(s): i - xv
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      The prelims comprise:
      Half Title
      IEEE Press Board Page
      Title
      Copyright
      Contents
      Preface to the Second Reprint Edition View full abstract»

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      Contributors

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.contrib
      Page(s): xvii - xviii
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
      Packaging materials and applications
      Modeling and simulations
      Analytical techniques for materials
      MEMS packaging
      Fabrication technologies and package design
      Reliability
      Electrical, mechanical, and thermal considerations
      Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists. View full abstract»

    • Full text access may be available. Click article title to sign in or learn about subscription options.

      Acronyms

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.acron
      Page(s): xix - xxvi
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
      Packaging materials and applications
      Modeling and simulations
      Analytical techniques for materials
      MEMS packaging
      Fabrication technologies and package design
      Reliability
      Electrical, mechanical, and thermal considerations
      Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists. View full abstract»

    • Full text access may be available. Click article title to sign in or learn about subscription options.

      Introduction and Overview of Microelectronic Packaging

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch1
      Page(s): 1 - 27
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Functions of an Electronic Package
      Packaging Hierarchy
      Brief History of Microelectronic Packaging Technology
      Driving Forces on Packaging Technology
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Materials for Microelectronic Packaging

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch2
      Page(s): 29 - 76
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Some Important Packaging Material Properties
      Ceramics in Packaging
      Polymers in Packaging
      Metals in Packaging
      Materials Used in High-density Interconnect Substrates
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Processing Technologies

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch3
      Page(s): 77 - 103
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Thin-Film Deposition
      Patterning
      Metal-to-Metal Joining
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Organic Printed Circuit Board Materials and Processes

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch4
      Page(s): 105 - 147
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Common Issues for All PCB Layer Constructions
      PCB Process Flow
      Dielectric Materials
      Surface Finishes
      Advanced PCB Structures
      Specifications and Standards
      Key Terms This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Ceramic Substrates

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch5
      Page(s): 149 - 185
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Ceramics in Electronic Packaging
      Electrical Properties of Ceramic Substrates
      Mechanical Properties of Ceramic Substrates
      Physical Properties of Ceramic Substrates
      Design Rules
      Thin Film on Ceramics
      Thick Films on Ceramics
      Low-Temperature Cofired Ceramics (LTCC)
      HTCC Fabrication Process
      High-Current Substrates
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Electrical Considerations, Modeling, and Simulation

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch6
      Page(s): 187 - 246
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Fundamental Considerations
      Signal Integrity and Modeling
      Transmission Lines
      Coupled Noise or Crosstalk
      Power and Ground
      Overall Packaged IC Models and Simulation
      Time-Domain Reflectometry
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Thermal Considerations

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch7
      Page(s): 247 - 298
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Heat Transfer Fundamentals
      Air Cooling
      Liquid Cooling
      Advanced Cooling Methods
      Computer-Aided Modeling
      Summary This chapter contains sections titled:
      References
      Appendix: Thermophysical Properties for Heat Transfer Calculations
      Exercises View full abstract»

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      Mechanical Design Considerations

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch8
      Page(s): 299 - 347
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Deformation and Strain
      Stress
      Constitutive Relations
      Simplified Forms
      Failure Theories
      Analytical Determination of Stress
      Numerical Formulations
      Summary This chapter contains sections titled:
      References
      Bibliography
      Exercises View full abstract»

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      Discrete and Embedded Passive Devices

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch9
      Page(s): 349 - 387
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Passives in Modern Electronic Systems
      Definitions and Configurations of Passives
      Film-Based Passives
      Resistors
      Capacitors
      Inductors
      Electrical Characteristics of Passives
      Issues in Embedding Passives
      Decoupling Capacitors
      Future of Passives This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Electronic Package Assembly

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch10
      Page(s): 389 - 436
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Facilities
      Component Handling
      Surface-Mount Technology (SMT) Assembly
      Wafer Preparation
      Die Attachment
      Wirebonding
      Flip-Chip
      Package Sealing/Encapsulation/Coating
      Package-Level Processes
      State-of-the-Art Technologies
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Design Considerations

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch11
      Page(s): 437 - 485
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Packaging and the Electronic System
      Trade-Offs Among Packaging Functions
      Trade-Off Design Example
      Product Development Cycle
      Design Concepts
      PCB/MCM Board Design Process
      Summary This chapter contains sections titled:
      References
      Bibliography
      Exercises View full abstract»

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      Radio Frequency and Microwave Packaging

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch12
      Page(s): 487 - 535
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction and Background
      Transmission Lines
      High-Frequency Circuit Implementation
      Lumped-Element Components
      Distributed Components
      Simulation and Circuit Layout
      Measurement and Testing
      Frequency-Domain Measurements
      Time-Domain Measurements
      Design Example
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Power Electronics Packaging

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch13
      Page(s): 537 - 581
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Semiconductor Power Device Technology
      Commercially Available Power Packages
      Power Packaging Design Methodology
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Multichip and ThreeDimensional Packaging

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch14
      Page(s): 583 - 623
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Packaging Hierarchy and Taxonomy
      Three-Dimensional Systems
      Options in Multichip Packaging
      Emerging Trends in Density Scaling
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Packaging of MEMS and MOEMS: Challenges and a Case Study

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch15
      Page(s): 625 - 650
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Background
      Challenges in Mems Integration
      Packaging Considerations and Guidelines Related to the Digital Micromirror Device
      Future Packaging Challenges This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Reliability Considerations

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch16
      Page(s): 651 - 689
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Failure Mechanisms
      Accelerated Testing
      Reliability Metrology
      Failure Statistics for Microelectronic Systems
      Industrial Practice of Reliability Science for Microelectronics This chapter contains sections titled:
      Bibliography
      Exercises View full abstract»

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      Cost Evaluation and Analysis

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch17
      Page(s): 691 - 724
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Product Cost
      Break-even Analysis
      Learning Curve Relationships
      Forecasting Models
      Comparative Analysis
      Sensitivity Analysis
      Summary This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Analytical Techniques for Materials Characterization

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.ch18
      Page(s): 725 - 791
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Overview
      X-Ray Diffraction
      Raman Spectroscopy
      Scanning Probe Microscopy
      Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy
      Confocal Microscopy
      Auger Electron Spectroscopy
      X-ray Photoelectron Spectroscopy
      Secondary Ion Mass Spectrometry This chapter contains sections titled:
      References
      Exercises View full abstract»

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      Index

      Ulrich, R. ; Brown, W.
      Advanced Electronic Packaging

      DOI: 10.1109/9780471754503.index
      Page(s): 793 - 812
      Copyright Year: 2006

      Wiley-IEEE Press eBook Chapters

      Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
      Packaging materials and applications
      Modeling and simulations
      Analytical techniques for materials
      MEMS packaging
      Fabrication technologies and package design
      Reliability
      Electrical, mechanical, and thermal considerations
      Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists. View full abstract»




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