Advanced Integrated Communication Microsystems

The prelims comprise:
Half Title
Title
Copyright
Contents
Preface
Acknowledgments View full abstract»

Introduction
Communication Systems
History and Overview of Wireless Communication Systems
History and Overview of Wired Communication Systems
Communication System Fundamentals
Electromagnetics
Analysis of Circuits and Systems
Broadband, Wideband, and Narrowband Systems
Semiconductor Technology and Devices
Key Circuit Topologies
Gain/Linearity/Noise
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Fundamental Considerations
Link Budget Analysis
Propagation Effects
Interface Planning
Superheterodyne Architecture
Low IF Architecture
Direct Conversion Architecture
Two-Stage Direct Conversion
Current-Mode Architecture
Subsampling Architecture
Multiband Direct Conversion Radio
Polar Modulator
Harmonic Reject Architecture
Practical Considerations for Transceiver Integration
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Bandlimited Channel
Equalizer System Study
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Inverters
Static D Flip-Flop
Bias Circuits
Transconductor Cores
Load Networks
A Versatile Analog Signal Processing Core
Low Noise Amplifier
Power Amplifiers
Balun
Signal Generation Path
Mixers
Baseband Filters
Signal Strength Indicator (SSI)
ADC/DAC
Latch
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Direct Conversion Receiver Front End
Debugging: A Practical Scenario
High-Speed Wired Communication Example
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Power Consumption Considerations
Device Technology and Scaling
Low-Voltage Design Techniques
Injection-Locked Techniques
Subharmonic Architectures
Super-Regenerative Architectures
Hearing Aid Applications
Radio Frequency Identification Tags
Ultra-Low-Power Radios
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Background
Elements of a Package
Current Chip Packaging Technologies
Driving Forces for RF Packaging Technology
MCM Definitions and Classifications
RF-SOP Modules
Package Modeling and Optimization
Future Packaging Trends
Chip-Package Codesign
Package Models and Transmission Lines
Calculations for Package Elements
Crosstalk
Grounding
Practical Issues in Packaging
Chip-Package Codesign Examples
Wafer Scale Package
Filters Using Bondwire
Packaging Limitation
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
History of Compact Design
Previous Techniques in Performance Enhancement
Design Complexities
Modeling Complexities
Compact Stacked Patch Antennas Using LTCC Multilayer Technology
Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology
Radiation-Pattern Improvement Using a Compact Soft-Surface Structure
A Package-Level-Integrated Antenna Based on LTCC Technology
Conclusion
References View full abstract»

This chapter contains sections titled:
Introduction
Computer-Aided Analysis of Wireless Systems
Measurement Equipments and their Operation
Network Analyzer Calibration
Wafer Probing Measurement
Characterization of Integrated Radios
In the Lab
Conclusion
References View full abstract»

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