Advanced Integrated Communication Microsystems

Cover Image Copyright Year: 2007
Author(s): Joy Laskar; Sudipto Chakraborty; Anh-Vu Pham; Manos M. Tantzeris
Book Type: Wiley-IEEE Press
Content Type : Books & eBooks
Topics: Communication, Networking & Broadcasting ;  Components, Circuits, Devices & Systems ;  Signal Processing & Analysis
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Abstract

Learn the fundamentals of integrated communication microsystems

Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration.

This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores:

  • Fundamental requirements of communication microsystems

  • System design and considerations for wired and wireless communication microsystems

  • Advanced block-level design technique for communication microsystems

  • Integration of communication systems in a hybrid environment

  • Packaging considerations

  • Power and form factor trade-offs in building integrated microsystems

Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.

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    Wireless Communication System Architectures

    Copyright Year: 2007

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    This chapter contains sections titled:

  • Introduction

  • Fundamental Considerations

  • Link Budget Analysis

  • Propagation Effects

  • Interface Planning

  • Superheterodyne Architecture

  • Low IF Architecture

  • Direct Conversion Architecture

  • Two-Stage Direct Conversion

  • Current-Mode Architecture

  • Subsampling Architecture

  • Multiband Direct Conversion Radio

  • Polar Modulator

  • Harmonic Reject Architecture

  • Practical Considerations for Transceiver Integration

  • Conclusion

  • References

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    System Architecture for HighSpeed Wired Communications

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Bandlimited Channel

  • Equalizer System Study

  • Conclusion

  • References

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    Mixed Building Blocks of Signal Communication Systems

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Inverters

  • Static D Flip-Flop

  • Bias Circuits

  • Transconductor Cores

  • Load Networks

  • A Versatile Analog Signal Processing Core

  • Low Noise Amplifier

  • Power Amplifiers

  • Balun

  • Signal Generation Path

  • Mixers

  • Baseband Filters

  • Signal Strength Indicator (SSI)

  • ADC/DAC

  • Latch

  • Conclusion

  • References

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    Examples of Integrated Communication Microsystems

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Direct Conversion Receiver Front End

  • Debugging: A Practical Scenario

  • High-Speed Wired Communication Example

  • Conclusion

  • References

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    LowVoltage, LowPower, and LowArea Designs

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Power Consumption Considerations

  • Device Technology and Scaling

  • Low-Voltage Design Techniques

  • Injection-Locked Techniques

  • Subharmonic Architectures

  • Super-Regenerative Architectures

  • Hearing Aid Applications

  • Radio Frequency Identification Tags

  • Ultra-Low-Power Radios

  • Conclusion

  • References

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    Packaging for Integrated Communication Microsystems

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Background

  • Elements of a Package

  • Current Chip Packaging Technologies

  • Driving Forces for RF Packaging Technology

  • MCM Definitions and Classifications

  • RF-SOP Modules

  • Package Modeling and Optimization

  • Future Packaging Trends

  • Chip-Package Codesign

  • Package Models and Transmission Lines

  • Calculations for Package Elements

  • Crosstalk

  • Grounding

  • Practical Issues in Packaging

  • Chip-Package Codesign Examples

  • Wafer Scale Package

  • Filters Using Bondwire

  • Packaging Limitation

  • Conclusion

  • References

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    Advanced SOP Components and Signal ProcessingThis chapter has been contributed by Dr. Rong Lin Li of Georgia Institute of Technology

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • History of Compact Design

  • Previous Techniques in Performance Enhancement

  • Design Complexities

  • Modeling Complexities

  • Compact Stacked Patch Antennas Using LTCC Multilayer Technology

  • Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology

  • Radiation-Pattern Improvement Using a Compact Soft-Surface Structure

  • A Package-Level-Integrated Antenna Based on LTCC Technology

  • Conclusion

  • References

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    Simulation and Characterization of Integrated Microsystems

    Advanced Integrated Communication Microsystems
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Computer-Aided Analysis of Wireless Systems

  • Measurement Equipments and their Operation

  • Network Analyzer Calibration

  • Wafer Probing Measurement

  • Characterization of Integrated Radios

  • In the Lab

  • Conclusion

  • References

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    Appendix: A Compendium of the TRL Calibration Algorithm

    Advanced Integrated Communication Microsystems
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    Wiley-IEEE Press eBook Chapters

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    Index

    Advanced Integrated Communication Microsystems
    Page(s): 469 - 473
    Copyright Year: 2007

    Wiley-IEEE Press eBook Chapters

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