Accelerated Stress Testing Handbook:Guide for Achieving Quality Products

Cover Image Copyright Year: 2001
Author(s): H. Anthony Chan
Book Type: Wiley-IEEE Press
Content Type : Books & eBooks
Topics: Components, Circuits, Devices & Systems
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Abstract

As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

Important topics covered include:

  • Theoretical basi for AST
  • General AST best practices
  • AST design and manufacturing processes
  • AST equipment and techniques
  • AST process safety qualification
In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.

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      Frontmatter

      Page(s): ii - xxii
      Copyright Year: 2001

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      The prelims comprise:
      Half Title
      IEEE Press Board Page
      Title
      Copyright
      Dedicated
      Contents
      Foreword
      Preface
      Acknowledgments View full abstract»

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      Overview

      Page(s): 1
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      As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

      The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

      Important topics covered include:

      • Theoretical basi for AST
      • General AST best practices
      • AST design and manufacturing processes
      • AST equipment and techniques
      • AST process safety qualification
      In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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      Introduction

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      This chapter contains sections titled:

    • Synopsis of Reliability Trends and Aim of Book

    • Background of Military and Industrial Stress Testing Practices

    • Overview of the AST Handbook

    • References

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    Principles of Stress Testing

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    This chapter contains sections titled:

  • Rationale for Stress Testing

  • Stress Testing Technical and Implementation Issues

  • Economic Issues

  • References

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    Process and Guidelines

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    Stress Testing Program: Generic Processes

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    This chapter contains sections titled:

  • Overview of the Stress Testing Strategy

  • Design Stress Testing (D-AST)

  • Manufacturing Qualification Stress Testing (MQ-AST)

  • Periodic Qualification Stress Testing (PQ-AST)

  • Production Sampling Stress Testing (PS-AST)

  • Full-Production Stress Testing (FP-AST)

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    Stress Testing Program Subprocesses

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    This chapter contains sections titled:

  • Plan Program Subprocess (A)

  • Baseline Product Subprocess (B)

  • Take Corrective Action Subprocess (C)

  • Develop Manufacturing Stress Testing Regimen Subprocess (D)

  • Demonstrate Safety of the Stress Testing Regimen Subprocess (E)

  • Perform Manufacturing Stress Testing Subprocess (F)

  • Optimize the Manufacturing Stress Testing Regimen Subprocess (G)

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    Guidelines for Design and Manufacturing Stress Testing

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    This chapter contains sections titled:

  • AST Test Strategy

  • AST Plan

  • Sample Size Selection for Design AST

  • Typical Stress Stimuli and Associated Product Flaws

  • Recommended Stress Levels

  • Baseline Product Test Procedures

  • Failure Mode Analysis and Root Cause Analysis

  • Corrective Action and Product Ruggedization

  • References

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    Theory

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 91
    Copyright Year: 2001

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    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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    Economics and Optimization

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Guidelines for Optimizing Manufacturing Stress Testing

  • Formulation

  • Reliability Objective

  • Types of Failures Revisited

  • Distribution of Environmental Stresses

  • Effect of Stress Testing

  • Reliability Requirements

  • Requirement on Service-Life Fraction Failed

  • Requirement on Product Strength Distribution

  • Examples

  • Economic Issues and Optimization

  • Net Benefit

  • Optimization

  • Product Considerations

  • Economic Summary

  • References

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    Reliability GrowthReprinted with editorial changes from Achieving Phenomenal Reliability Growth, by Clifton J. Seusy with permission from Proceedings of the ASM Conference on Reliability, pp. 7988, 1987, ASM InternationalMaterials Park, Ohio.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    This chapter is one of several in this book that was reprinted with permission of the author. Again recognizing that there are a myriad of viable AST techniques outside of the scope of the AT&T and Lucent reliability procedures, in this portion of the book we provide a complementary approach to the economics and optimization methods delineated in Chapter 6. Though written quite a while ago (1987), Seusy's work is still highly applicable in today's drive to achieve high reliability in a globally competitive marketplace. He initially applies a theoretical treatment to the fundamental question that any reliability engineer must answer: How many units do I need to test given constraints of money, time, and effort to attain one's reliability goals? After presenting a methodology to answer this question, he proceeds to practical discussions of prototype acquisition, stressing, failure mode analysis and tracking, and corrective action. The tools presented here were derived from statistical theory and from experience. Numerous case studies are presented to illustrate the successful application of these principles.

  • What Is Reliability Growth?

  • How Many Units Must Be Tested?

  • Failure Mode Distribution

  • How Are These Units Acquired?

  • The Success of Failures Attained by Stress Testing

  • Results

  • Conclusions

  • Acknowledgments

  • References

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    Overview of the Failure Analysis Process for Electrical Components

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter presents a person who is not a failure analysis expert with an overview of the failure analysis process. The focus is on an example of electrical components, although the process is applicable to a wide variety of problems. A list of tools necessary for a basic failure analysis lab is presented. A discussion of what you, as a failure analysis customer, can do to optimize the FMA process. Finally, some of the future challenges facing the failure analysis discipline are presented.

  • Definition of Failure Analysis

  • The Benefits of Performing Failure Analysis

  • Overview of the Failure Analysis Process for Electrical Components

  • Tools for Component Failure Analysis

  • Personnel for Component Failure Analysis

  • Challenges Facing Failure Analysts in the Future

  • What the Customer Can Do to Optimize the Failure Analysis Process

  • References

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    Equipment and Techniques

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 135
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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    Accelerated Stress Testing Equipment and Techniques

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Introduction

  • Thermal Equipment

  • Vibration Equipment

  • Combined Thermal and Vibration Equipment

  • Ancillary Mechanical Equipment for Stress Testing

  • Environmental Analysis Equipment Used for Stress Testing

  • Electrical Test Equipment and Software Used for Stress Testing

  • Other Stress Options

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    Vibration and Shock Inputs Indentify Some Failure ModesExtracted from material presented by the Equipment Reliability Institute, http://www.equipmentreliability.com

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Why Important?

  • Vibration Measurements

  • Controllable Sources of Vibration and Mechanical Shock

  • Characteristics of Shock, Sine, and Random Vibration

  • Multi-Axis Excitation

  • Repetitive Shock Machines for Multi-Axis Stress Testing

  • Using Random Vibration and Repetitive Shock for Stress Testing

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    Relative Effectiveness of Thermal Cycling versus BurnIn

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    An accelerated stress testing (AST) program was conducted at AT&T on various types of communications equipment. One issue of concern in developing an appropriate AST regimen is the effectiveness of thermal cycling and burn-in in revealing potential reliability problems. This of course depends on the type and distribution of failure modes that happen to be present in a particular product. However, similar electronic equipment might have similar failure modes in general. Two experiments have been conducted to gauge the relative effectiveness of thermal cycling and burn-in for a typical communications system that used optical transmission. The first AST regimen was a series of thermal cycles (A) followed by an extended period of burn-in (B). This order was reversed in the second AST regimen, which consists of burn-in (B) followed by thermal cycling (A). By comparing the failure distributions in time for the AB and BA experiments, one can discern the relative effectiveness of the thermal cycling and burn-in for stimulating failures. The results clearly show that thermal cycling reveals important failure modes that are not effectively precipitated by burn-in alone. Some of these failures occur as intermittent failures during the temperature transients. Moreover, thermal cycling does tend to reveal many of the same failure modes precipitated by burn-in because the thermocyclic test regimen inherently involves successive time intervals at elevated temperature. On the other hand, the data suggest that time-at-temperature (burn-in) failures are also involved. Therefore, a balanced test regimen of thermal cycling and burn-in seems advisable.

  • Introduction

  • Results for Thermal Cycling Alone

  • Intermittents and First Events

  • Thermal Cycling Versus Burn -In

  • Failure Mechanisms

  • Conclusion

  • Acknowledgments

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    Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid?

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    The superposition of thermal cycling and vibration loading has been experimentally observed to slow down fatigue damage accumulation rates in solder joints as compared to damage accumulation due to vibration load alone. The reverse may occur for some other load combinations. The popular Palmgren-Miner's hypothesis, which linearly superposes the separate damage caused by each load, is not suitable for explaining the observed trend because interactions between the thermal and vibration loads are ignored in linear damage superposition schemes. Obtaining a meaningful acceleration transform (acceleration transform correlates the accelerated life test results to field life expectations) therefore hinges on the ability to capture the interactive effects between applied loads in the failure models. A modeling approach based on physics of failure (PoF) is presented that adequately quantifies the complex interactions between temperature and vibration loads using an incremental damage superposition approach (IDSA). The first modeling approach (macroscale IDSA) is formulated at the macroscale without any attention to microstructural phenomena, and it phenomenologically captures the dominant failure drivers. The second modeling approach (microscale IDSA) is formulated at the microscale and incorporates the underlying physical mechanisms and microstructural parameters that drive the failure process. Both macroscale and microscale damage models are applied to predict the durability of a selected surface mount interconnect architecture (84-pin plastic-leaded chip carrier). The prediction trends are found to be in good agreement with the experimental results, confirming that the dominant damage contributors have been successfully captured in the IDSA model. This study provides a systematic way of quantifying complex interactions between thermal cycling and vibration loads on durab ility of electronic assemblies. Furthermore, by incorporating the influences of microstructure on damage predictions, this study has also provided a new modeling approach to explicitly account for different microstructural states when extrapolating accelerated test results to field life conditions.

  • Introduction

  • Combined Temperature and Vibration Accelerated Life Tests

  • The Macroscopic Incremental Damage Superposition Approach Macro-IDSA)

  • The Micromechanistic Incremental Damage Superposition Approach (Micro-IDSA)

  • Conclusions

  • Acknowledgments

  • References

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    Liquid Environmental Stress Testing (LEST)

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Advantages of Liquid Environmental Stress Testing

  • Liquid Environmental Stress Testing Facility

  • Thermal Considerations in Liquid Environmental Stress Testing

  • Conclusions

  • References

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    Safety Qualification of Stress Testing

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    This chapter contains sections titled:

  • Stress Testing Safety Qualification Program

  • Safety Qualification Programs for Other Types of Stresses

  • References

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    Best Practices Case Studies in Computer, Communications, and other Industries

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    Production AST with Computers Using the Taguchi Method - Reprinted from Environmental Stress Testing Experiment Using the Taguchi Method, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No.1, pp. 39, with permission from the author and the IEEE, 1995.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
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    Manufacturing process improvements which increase productivity, decrease test process time, and improve customer satisfaction are highly desirable in today's marketplace. The application of environmental stress screening (ESS), i.e, Production AST, is a method of achieving these improvements. ESS is the application of stresses applied beyond product specification limits in order to find latent product defects. Utilizing ESS achieves increased robustness and lowers infant mortality.

    An experiment was performed to identify the significance or relevancy of the selected stresses for application in the printed wiring assembly (PWA) production process by using a statistically significant controlled method. The design of experiments statistical approach (analysis of variance) is applied, combined with the Taguchi two-level, seven-factor design method.

    This experiment concentrated on three stresses?-?temperature cycling, random vibration, and power cyling?-?and two diagnostic levels?-?a prom-based (programmable memory chip), power-on self test (POST), and a functional diagnostic test suite, contained on disk storage.

    This was not an optimization experiment. Once the significance to the production process is identified, future optimizing of temperature cycling, power cycling, and vibration screens will be conducted. Also, voltage margining was not included to reduce the complexity of the experiment-treatment factors and interactions. Experimental results and conclusions on the effectiveness of different stress regimens are presented in this chapter.

  • Introduction

  • Objectives

  • Stress Overview

  • Stress Screen Designs

  • Experiment Overview

  • The Taguchi Method

  • Response Variable Results and Conclusions of the Taguchi Experiment

  • Intra-Experiment Summary

  • Taguchi Method Conclusion

  • Terms

  • Acknowledgments

  • References

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    Design AST with Vendor Electronics - Reprinted from Reliability Growth Through Application of Accelerated Reliability Techniques and Continual Improvement Processes, Proceedings of the IES Annual Technical Meeting, pp. 347354, with permission from the author and the Institute of Environmental Sciences and Technology (IEST) 1991.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Introduction

  • The Test-Analyze-Correct-Verify Process

  • Accelerated Reliability Techniques (ART)

  • Original Equipment Manufacturer (OEM) Power Supply Example

  • Conclusions

  • Acknowledgments

  • References

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    Design and Production AST with Power Supplies - Reprinted with editing from Use of Environmental Stress Screening in Development and Manufacturing of Switching Power Supplies, Proceedings of the IES ESSEH Meeting, pp. 6569, with permission from the author and the Institute of Environmental Sciences (IES) 1990.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Background

  • STRIFE in New Product Development (Design AST)

  • ESS in Manufacturing (Production AST)

  • Final Conclusions

  • Acknowledgments

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    Design and Production AST with Computers - Reprinted from Reliability Enhancement of a New Computer by ESS Part 2: Field Results, Proceedings of the IES Annual Technical Meeting, pp. 127132, with permission from the author and the Institute of Environmental Sciences and Technology (IEST) 1996.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Background

  • The ESS Program

  • Conclusions

  • Acknowledgments

  • Definitions and Acronyms

  • Reference

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    Qualification and Production Sampling AST with Printed Circuit BoardsReprinted from Hightly Accelerated Stressing of Products with Very Low Failure Rates, Proceedings of the IES Annual Technical Meeting, pp. 443450, with permission from the author and the Institute of Environmental Sciences (IES) 1992.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Introduction

  • Proposed Test and Theory

  • Ongoing Monitoring of the Production Process

  • Screen Development

  • Equipment

  • Results of the Initial Testing

  • Conclusions

  • Acknowledgments

  • Glossary

  • References

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    Manufacturing AST with Telecommunication Products - Reprinted from Quality Improvement Using Environmental Stress Testing, in the AT&T Technical Journal, pp. 1023, with permission from the authors and the AT&T Technical Journal 1992.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    AT&T and other leading manufacturers have developed techniques that use environmental stress testing to enhance the quality and reliability of electronics assemblies. These techniques consist primarily of applying thermal, vibration, and voltage stresses to components or assemblies during design and manufacturing. Environmental stress testing is a tool that is used to accelerate the detection of product weaknesses. When coupled with corrective-action programs, this tool also enhances product quality and reliability. This chapter discusses applications of environmental stress testing in the electronics industry. It also reviews the results of environmental stress testing at AT&T's Little Rock Operations Center in Arkansas as applied primarily to the manufacture of circuit-card assemblies.

  • Introduction

  • EST During Product Design (Design AST)

  • Production EST (AST)

  • Production EST (AST) Studies at AT&T

  • Results of the Thermal Cycling Studies

  • Acknowledgments

  • References

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    Production AST with Computer Disks - Reprinted from A Method of Reliability Improvement Using Accelerated Testing Methodologies, in the Proceedings of the NEPCON West Conference, pp. 431439, with permission from the author and Reed Exhibition Companies 1996.

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    Reliability growth is a major goal of many new product introductions. There are many ways of achieving this growth in a new product. One of the new methods, production AST or highly accelerated stress screening (HASS)[1], is discussed in this chapter. Utilizing Highly Accelerated Stress Screening along with highly focused root cause analysis win help reliability grow rapidly, which is highly desirable in today's fast-moving time-to-market-driven companies. An example of how this process works based on the experience gained in the introduction of a new power system is discussed. HASS is part of an overall iterative process of forcing failures, analysis, correction, and retesting. HASS itself needs to be continually monitored for its effectiveness, and corrections must be made for missed defects. Case studies, with reliability data, are presented to demonstrate how HASS can be a major part of a reliability growth process.

  • Introduction

  • Growing Reliability

  • Problem

  • Case Study

  • Product Flow

  • Profile Utilized

  • A Look at the Failure Mechanisms

  • The Bottom Line

  • Conclusion

  • References

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    Benchmarking

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

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    This chapter contains sections titled:

  • Introduction to Benchmarking

  • The AST Benchmarking Process

  • Benchmarking Partnerships¿¿-¿¿Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics)

  • Benchmarking AST Survey Data

  • Summary

  • Acknowledgments

  • References

  • Appendix A Environmental Stress Screening Questionnaire¿¿-¿¿1997

  • Appendix B Environmental Stress Screening Questionnaire¿¿-¿¿;1996 & 1997 Results

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    Glossary of Stress Testing Terminology

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 338 - 339
    Copyright Year: 2001

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    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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    Bibliography

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 340 - 363
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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    Index

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 365 - 368
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»

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    Epilogue

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

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    About the Editors

    Accelerated Stress Testing Handbook:Guide for Achieving Quality Products
    Page(s): 371 - 372
    Copyright Year: 2001

    Wiley-IEEE Press eBook Chapters

    As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

    The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

    Important topics covered include:

    • Theoretical basi for AST
    • General AST best practices
    • AST design and manufacturing processes
    • AST equipment and techniques
    • AST process safety qualification
    In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. View full abstract»



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