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Advanced Electronic Packaging:With Emphasis on Multichip Modules

Cover Image Copyright Year: 1999
Author(s): William D. Brown
Publisher: Wiley-IEEE Press
Content Type : Books & eBooks
Topics: Components, Circuits, Devices & Systems
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Abstract

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

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      Frontmatter

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      The prelims comprise:
      Half Title
      IEEE Press Board Page
      Title
      Copyright
      Dedication
      Contents
      List of Contributors
      List of Acronyms
      Preface View full abstract»

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      Introduction and Overview of Microelectronics Packaging

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Functions of an Electronic Package
      Packaging Hierarchy
      A Brief History of Microelectronic Packaging Technology
      Driving Forces on Packaging Technology
      MCM Definitions and Classifications
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Microelectronics Packaging Materials and Applications

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Some Important Packaging Material Properties
      Ceramics in Packaging
      Plastics in Packaging
      Metals in Packaging
      Materials Used in Multichip Module Packaging
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Electrical Design Considerations

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Fundamental Considerations
      Signal
      Transmission Lines
      Coupled Noise or Crosstalk
      Power and Ground
      Time-Domain Reflectometry
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Modeling and Simulation

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      When is a Wire Not a Wire?
      Parameter Extraction Programs
      Component Models
      Interconnect Models
      Simulation
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Thermal Design and Management of Electronics

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Heat Transfer Fundamentals
      Air Cooling
      Liquid Cooling
      Advanced Cooling
      Summary This chapter contains sections titled:
      Exercises
      References
      Appendix 5.A: Thermophysical Properties for Heat Transfer Calculations View full abstract»

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      Mechanical Design Considerations

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Deformation and Strain
      Stress
      Constitutive Relations
      Simplified Forms
      Failure Theories
      Analytical Determination of Stress
      Numerical Formulations
      Summary This chapter contains sections titled:
      Exercises
      References
      Bibliography View full abstract»

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      Packaging TradeOffs and Decisions

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Packaging Functions
      Metrics
      System Constraints
      System Partitioning
      Signal Wiring
      Power Distribution
      Thermal Management
      Testing
      A Design Example
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      ComputerAided Engineering and Design

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Design Methodology
      Functional Specification
      Functional Verification
      Place and Route
      Analysis
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Processing Technologies in Microelectronic Packaging

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Process Sequence for Single Chip Packaging
      Ceramic Processing
      Thin Film Metallization Techniques
      Patterning
      Metal-to-Metal Joining
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Materials and Processing Considerations

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Substrate Materials
      Dielectric Materials
      Metallization
      Planarization
      Chip Bonding Technologies
      Die Attach
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Reliability Considerations

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Failure Mechanisms
      Accelerated Testing
      Reliability Metrology
      Failure Statistics for Microelectronics Systems
      The Industrial Practice of Reliability Science for Microelectronics
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Testing and Qualification

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Testing: General Concepts
      Testing of Memory Chips
      Design for Testability
      Other Aspects of Functional Testing
      Critical Issue: Boundary Scan
      Critical Issue: Known Good Die (KGD)
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Mainframe Packaging: The Thermal Conduction Module (TCM)

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      TCM Definitions
      TCM Substrate Technologies
      TCM Attributes
      Competitive Mainframe Packaging Examples
      Future Mainframe Packaging Trends
      Summary This chapter contains sections titled:
      Acknowledgments
      Exercises
      References View full abstract»

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      An Industry Perspective on MCMD

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      MCM Definition: Pre-Design Laundry List
      Design
      Packaging
      Substrate Manufacturing
      Assembly
      Test
      Summary This chapter contains sections titled:
      References View full abstract»

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      Automotive Multichip Modules

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Historical Powertrain Electronics Packaging Strategy
      Automotive Environmental Conditions
      Design Options
      Test Development for Motorola QFP [15.5]
      EMC Testing [15.7]
      Cost Analysis
      Summary This chapter contains sections titled:
      Acknowledgments
      References
      Appendix A15: Laminate MicroInterconnect (LMI) View full abstract»

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      Analytical Techniques for Materials Characterization

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction and Overview
      X??-??ray Diffraction (XRD)
      Raman Spectroscopy
      Scanning Probe Microscopy (SPM)
      Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Spectroscopy (EDX or EDS)
      Auger Electron Spectroscopy (AES)
      X??-??ray Photoelectron Spectroscopy (XPS)
      Secondary Ion Mass Spectrometry (SIMS)
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Cost Considerations

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Conventional Costing Procedures
      Cost/Quantity Relationships
      MCM Basics and Cost Trends
      Analyzing Costs/Benefits for MCMs
      Testing Costs
      Stackable Chip Carriers
      MCM Cost and Sales Forecasts
      Summary This chapter contains sections titled:
      Exercises
      References View full abstract»

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      Advanced Topics and Future Trends in MCM Technology

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      This chapter contains sections titled:
      Introduction
      Packaging Perspective
      Integrated Circuit Technology
      Integrated Circuit Technology Generations
      National Technology Roadmap for Semiconductors
      NTRS Assembly and Packaging
      Interconnect Technology Issues
      Emergence of MCM Technology
      Three-Dimensional (3-D) MCMs
      System-On-Chip
      Superconductor Interconnects
      Optical Interconnects
      Diamond Substrates
      Summary This chapter contains sections titled:
      References View full abstract»

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      Index

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

      With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

      As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

      An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»

    • Full text access may be available. Click article title to sign in or learn about subscription options.

      About the Editor

      William D. Brown
      Copyright Year: 1999

      Wiley-IEEE Press eBook Chapters

      Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

      With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

      As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

      An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»