Advanced Electronic Packaging:With Emphasis on Multichip Modules

Cover Image Copyright Year: 1999
Author(s): William D. Brown
Book Type: Wiley-IEEE Press
Content Type : Books & eBooks
Topics: Components, Circuits, Devices & Systems
  • Print

Abstract

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

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    Microelectronics Packaging Materials and Applications

    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Some Important Packaging Material Properties

  • Ceramics in Packaging

  • Plastics in Packaging

  • Metals in Packaging

  • Materials Used in Multichip Module Packaging

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Electrical Design Considerations

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Fundamental Considerations

  • Signal

  • Transmission Lines

  • Coupled Noise or Crosstalk

  • Power and Ground

  • Time-Domain Reflectometry

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Modeling and Simulation

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • When is a Wire Not a Wire?

  • Parameter Extraction Programs

  • Component Models

  • Interconnect Models

  • Simulation

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Thermal Design and Management of Electronics

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Heat Transfer Fundamentals

  • Air Cooling

  • Liquid Cooling

  • Advanced Cooling

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

  • Appendix 5.A: Thermophysical Properties for Heat Transfer Calculations

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    Mechanical Design Considerations

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Deformation and Strain

  • Stress

  • Constitutive Relations

  • Simplified Forms

  • Failure Theories

  • Analytical Determination of Stress

  • Numerical Formulations

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

  • Bibliography

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    Packaging TradeOffs and Decisions

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Packaging Functions

  • Metrics

  • System Constraints

  • System Partitioning

  • Signal Wiring

  • Power Distribution

  • Thermal Management

  • Testing

  • A Design Example

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    ComputerAided Engineering and Design

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Design Methodology

  • Functional Specification

  • Functional Verification

  • Place and Route

  • Analysis

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Processing Technologies in Microelectronic Packaging

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Process Sequence for Single Chip Packaging

  • Ceramic Processing

  • Thin Film Metallization Techniques

  • Patterning

  • Metal-to-Metal Joining

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Materials and Processing Considerations

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Substrate Materials

  • Dielectric Materials

  • Metallization

  • Planarization

  • Chip Bonding Technologies

  • Die Attach

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Reliability Considerations

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Failure Mechanisms

  • Accelerated Testing

  • Reliability Metrology

  • Failure Statistics for Microelectronics Systems

  • The Industrial Practice of Reliability Science for Microelectronics

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Testing and Qualification

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Testing: General Concepts

  • Testing of Memory Chips

  • Design for Testability

  • Other Aspects of Functional Testing

  • Critical Issue: Boundary Scan

  • Critical Issue: Known Good Die (KGD)

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Mainframe Packaging: The Thermal Conduction Module (TCM)

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • TCM Definitions

  • TCM Substrate Technologies

  • TCM Attributes

  • Competitive Mainframe Packaging Examples

  • Future Mainframe Packaging Trends

  • Summary

  • This chapter contains sections titled:

  • Acknowledgments

  • Exercises

  • References

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    An Industry Perspective on MCMD

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • MCM Definition: Pre-Design ?>Laundry List?>

  • Design

  • Packaging

  • Substrate Manufacturing

  • Assembly

  • Test

  • Summary

  • This chapter contains sections titled:

  • References

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    Automotive Multichip Modules

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Historical Powertrain Electronics Packaging Strategy

  • Automotive Environmental Conditions

  • Design Options

  • Test Development for Motorola QFP [15.5]

  • EMC Testing [15.7]

  • Cost Analysis

  • Summary

  • This chapter contains sections titled:

  • Acknowledgments

  • References

  • Appendix A15: Laminate MicroInterconnect (LMI)

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    Analytical Techniques for Materials Characterization

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction and Overview

  • X¿¿-¿¿ray Diffraction (XRD)

  • Raman Spectroscopy

  • Scanning Probe Microscopy (SPM)

  • Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Spectroscopy (EDX or EDS)

  • Auger Electron Spectroscopy (AES)

  • X¿¿-¿¿ray Photoelectron Spectroscopy (XPS)

  • Secondary Ion Mass Spectrometry (SIMS)

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Cost Considerations

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Conventional Costing Procedures

  • Cost/Quantity Relationships

  • MCM Basics and Cost Trends

  • Analyzing Costs/Benefits for MCMs

  • Testing Costs

  • Stackable Chip Carriers

  • MCM Cost and Sales Forecasts

  • Summary

  • This chapter contains sections titled:

  • Exercises

  • References

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    Advanced Topics and Future Trends in MCM Technology

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Packaging Perspective

  • Integrated Circuit Technology

  • Integrated Circuit Technology Generations

  • National Technology Roadmap for Semiconductors

  • NTRS Assembly and Packaging

  • Interconnect Technology Issues

  • Emergence of MCM Technology

  • Three-Dimensional (3-D) MCMs

  • System-On-Chip

  • Superconductor Interconnects

  • Optical Interconnects

  • Diamond Substrates

  • Summary

  • This chapter contains sections titled:

  • References

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    Index

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

    With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

    As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

    An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»

  • Full text access may be available. Click article title to sign in or learn about subscription options.

    About the Editor

    Advanced Electronic Packaging:With Emphasis on Multichip Modules
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

    With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

    As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

    An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»



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