Advanced Electronic Packaging:With Emphasis on Multichip Modules

The prelims comprise:
Half Title
IEEE Press Board Page
Title
Copyright
Dedication
Contents
List of Contributors
List of Acronyms
Preface View full abstract»

This chapter contains sections titled:
Introduction
Functions of an Electronic Package
Packaging Hierarchy
A Brief History of Microelectronic Packaging Technology
Driving Forces on Packaging Technology
MCM Definitions and Classifications
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Some Important Packaging Material Properties
Ceramics in Packaging
Plastics in Packaging
Metals in Packaging
Materials Used in Multichip Module Packaging
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Fundamental Considerations
Signal
Transmission Lines
Coupled Noise or Crosstalk
Power and Ground
Time-Domain Reflectometry
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
When is a Wire Not a Wire?
Parameter Extraction Programs
Component Models
Interconnect Models
Simulation
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Heat Transfer Fundamentals
Air Cooling
Liquid Cooling
Advanced Cooling
Summary This chapter contains sections titled:
Exercises
References
Appendix 5.A: Thermophysical Properties for Heat Transfer Calculations View full abstract»

This chapter contains sections titled:
Introduction
Deformation and Strain
Stress
Constitutive Relations
Simplified Forms
Failure Theories
Analytical Determination of Stress
Numerical Formulations
Summary This chapter contains sections titled:
Exercises
References
Bibliography View full abstract»

This chapter contains sections titled:
Introduction
Packaging Functions
Metrics
System Constraints
System Partitioning
Signal Wiring
Power Distribution
Thermal Management
Testing
A Design Example
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Design Methodology
Functional Specification
Functional Verification
Place and Route
Analysis
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Process Sequence for Single Chip Packaging
Ceramic Processing
Thin Film Metallization Techniques
Patterning
Metal-to-Metal Joining
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Substrate Materials
Dielectric Materials
Metallization
Planarization
Chip Bonding Technologies
Die Attach
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Failure Mechanisms
Accelerated Testing
Reliability Metrology
Failure Statistics for Microelectronics Systems
The Industrial Practice of Reliability Science for Microelectronics
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Testing: General Concepts
Testing of Memory Chips
Design for Testability
Other Aspects of Functional Testing
Critical Issue: Boundary Scan
Critical Issue: Known Good Die (KGD)
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
TCM Definitions
TCM Substrate Technologies
TCM Attributes
Competitive Mainframe Packaging Examples
Future Mainframe Packaging Trends
Summary This chapter contains sections titled:
Acknowledgments
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
MCM Definition: Pre-Design Laundry List
Design
Packaging
Substrate Manufacturing
Assembly
Test
Summary This chapter contains sections titled:
References View full abstract»

This chapter contains sections titled:
Introduction
Historical Powertrain Electronics Packaging Strategy
Automotive Environmental Conditions
Design Options
Test Development for Motorola QFP [15.5]
EMC Testing [15.7]
Cost Analysis
Summary This chapter contains sections titled:
Acknowledgments
References
Appendix A15: Laminate MicroInterconnect (LMI) View full abstract»

This chapter contains sections titled:
Introduction and Overview
X - ray Diffraction (XRD)
Raman Spectroscopy
Scanning Probe Microscopy (SPM)
Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Spectroscopy (EDX or EDS)
Auger Electron Spectroscopy (AES)
X - ray Photoelectron Spectroscopy (XPS)
Secondary Ion Mass Spectrometry (SIMS)
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Conventional Costing Procedures
Cost/Quantity Relationships
MCM Basics and Cost Trends
Analyzing Costs/Benefits for MCMs
Testing Costs
Stackable Chip Carriers
MCM Cost and Sales Forecasts
Summary This chapter contains sections titled:
Exercises
References View full abstract»

This chapter contains sections titled:
Introduction
Packaging Perspective
Integrated Circuit Technology
Integrated Circuit Technology Generations
National Technology Roadmap for Semiconductors
NTRS Assembly and Packaging
Interconnect Technology Issues
Emergence of MCM Technology
Three-Dimensional (3-D) MCMs
System-On-Chip
Superconductor Interconnects
Optical Interconnects
Diamond Substrates
Summary This chapter contains sections titled:
References View full abstract»

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department. View full abstract»