EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple

Cover Image Copyright Year: 1999
Author(s): Mark I. Montrose
Book Type: Wiley-IEEE Press
Content Type : Books
Topics: Fields, Waves & Electromagnetics
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Abstract

This accessible, new reference work shows how and why RF energy is created within a printed circuit board and the manner in which propagation occurs. With lucid explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity and the mitigation process needed to prevent an EMC event. Author Montrose also shows the relationship between time and frequency domains to help you meet mandatory compliance requirements placed on printed circuit boards.

Using real-world examples the book features:

  • Clear discussions, without complex mathematical analysis, of flux minimization concepts
  • Extensive analysis of capacitor usage for various applications
  • Detailed examination of components characteristics with various grounding methodologies, including implementation techniques
  • An in-depth study of transmission line theory
  • A careful look at signal integrity, crosstalk, and termination

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      Frontmatter

      Page(s): i - xviii
      Copyright Year: 1999

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      The prelims comprise:
      Half-Title
      IEEE Press Editorial Board
      Title
      Copyright
      Dedication
      Contents
      Preface
      Acknowledgments View full abstract»

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      EMC Fundamentals

      Copyright Year: 1999

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      This chapter contains sections titled:

    • Fundamental Definitions

    • EMC Concerns for the Design Engineer

    • The Electromagnetic Environment

    • The Need to Comply (A Brief History of EMI)

    • Potential EMI/RFI Emission Levels for Unprotected Products

    • Methods of Noise Coupling

    • Nature of Interference

    • PCBs and Antennas

    • Causes of EMI¿¿-¿¿System Level

    • Summary for Control of Electromagnetic Radiation

    • References

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    EMC Inside the PCB

    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • EMC and the PCB

  • Theory of Electromagnetics (Made Simple)

  • Relationship Between Electric and Magnetic Sources (Made Simple)

  • Maxwell Simplified¿¿-¿¿Further Still

  • Concept of Flux Cancellation (Flux Minimization)

  • Skin Effect and Lead Inductance

  • Common-Mode and Differential-Mode Currents

  • Velocity of Propagation

  • Critical Frequency (?>/20)

  • Fundamental Principles and Concepts for Suppression of RF Energy

  • Summary

  • References

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    Components and EMC

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Edge Rate

  • Input Power Consumption

  • Clock Skew

  • Component Packaging

  • Ground Bounce

  • Lead-to-Lead Capacitance

  • Grounded Heatsinks

  • Power Filtering for Clock Sources

  • Radiated Design Concerns for Integrated Circuits

  • Summary for Radiated Emission Control¿¿-¿¿Component Level

  • References

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    Image Planes

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

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    This chapter contains sections titled:

  • Overview

  • 5/5 Rule

  • How Image Planes Work

  • Ground and Signal Loops (Not Eddy Currents)

  • Aspect Ratio¿¿-¿¿Distance Between Ground Connections

  • Image Planes

  • Image Plane Violations

  • Layer Jumping¿¿-¿¿Use of Vias

  • Split Planes

  • Partitioning

  • Isolation and Partitioning (Moating)

  • Interconnects and RF Return Currents

  • Layout Concerns for Single- and Double-Sided Boards

  • Gridded Ground System

  • Localized Ground Planes

  • Summary

  • References

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    Bypassing and Decoupling

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Review of Resonance

  • Physical Characteristics

  • Capacitors in Parallel

  • Power and Ground Plane Capacitance

  • Lead-Length Inductance

  • Placement

  • Selection of a Decoupling Capacitor

  • Selection of Bulk Capacitors

  • Designing a Capacitor Internal to a Component's Package

  • Vias and Their Effects in Solid Power Planes

  • References

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    Transmission Lines

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Overview on Transmission Lines

  • Transmission Line Basics

  • Transmission Line Effects

  • Creating Transmission Lines in a Multilayer PCB

  • Relative Permittivity (Dielectric Constant)

  • Routing Topologies

  • Routing Concerns

  • Capacitive Loading

  • References

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    Signal Integrity and Crosstalk

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Need for Signal Integrity

  • Reflections and Ringing

  • Calculating Trace Lengths (Electrically Long Traces)

  • Loading Due to Discontinuities

  • RF Current Distribution

  • Crosstalk

  • The 3-W Rule

  • References

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    Trace Termination

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Transmission Line Effects

  • Termination Methodologies

  • Terminator Noise and Crosstalk

  • Effects of Multiple Terminations

  • Trace Routing

  • Bifurcated Lines

  • Summary¿¿-¿¿Termination Methods

  • References

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    Grounding

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Reasons for Grounding¿¿-¿¿An Overview

  • Definitions

  • Fundamental Grounding Concepts

  • Safety Ground

  • Signal Voltage Referencing Ground

  • Grounding Methods

  • Controlling Common-Impedance Coupling Between Traces

  • Controlling Common-Impedance Coupling in Power and Ground

  • Ground Loops

  • Resonance in Multipoint Grounding

  • Field Transfer Coupling of Daughter Cards to Card Cage

  • Grounding (I/O Connector)

  • References

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    Glossary

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Page(s): 279 - 285
    Copyright Year: 1999

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    Bibliography

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
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    Appendix A: The Decibel

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
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    Appendix B: Fourier Analysis

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
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    Appendix C: Conversion Tables

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
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    Appendix D: International EMC Requirements

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Copyright Year: 1999

    Wiley-IEEE Press eBook Chapters

    This appendix contains sections titled:

  • Brief Summary of International EMC Requirements

  • Definition of Classification Levels¿¿-¿¿Emissions

  • FCC/ Industry Canada Emission Limits

  • International Emission Limits Summary¿¿-¿¿Sample List

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    Index

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Page(s): 317 - 324
    Copyright Year: 1999

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    About the Author

    EMC and the Printed Circuit Board:Design, Theory, and Layout Made Simple
    Page(s): 325
    Copyright Year: 1999

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