Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Cover Image Copyright Year: 2012
Author(s): Er-Ping Li
Book Type: Wiley-IEEE Press
Content Type : Books
Topics: Communication, Networking & Broadcasting ;  Components, Circuits, Devices & Systems ;  Computing & Processing
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    Supplemental Images

    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    The colour illustrations for Chapter 2, 3, and 5 are included, as follows:

  • Figures 1.3

  • Figures 3.6, 3.9, 3.16, 3.17, 3.18

  • Figures 4.8

  • Figures 5.18, 5.29

  • Figures 6.11

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    Introduction

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction of Electronic Package Integration

  • Review of Modeling Technologies

  • Organization of the Book

  • References

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    Macromodeling of Complex Interconnects in 3D Integration

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Network Parameters: Impedance, Admittance, and Scattering Matrices

  • Rational Function Approximation with Partial Fractions

  • Vector Fitting (VF) Method

  • Macromodel Synthesis

  • Stability, Causality, and Passivity of Macromodel

  • Macromodeling Applied to High-Speed Interconnects and Circuits

  • Conclusion

  • References

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    2.5D Simulation Method for 3D Integrated Systems

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems

  • Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes

  • Numerical Simulations for Finite Structures

  • Modeling of 3D Electronic Package Structure

  • Conclusion

  • References

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    Hybrid Integral Equation Modeling Methods for 3D Integration

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • 3D Hybrid Integral Equation Method

  • Conclusion

  • References

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    Systematic Microwave Network Analysis for 3D Integrated Systems

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair

  • Parallel Plane Pair Model

  • Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias

  • References

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    Modeling of Through-Silicon Vias (TSV) in 3D Integration

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

    This chapter contains sections titled:

  • Introduction

  • Equivalent Circuit Model for TSV

  • MOS Capacitance Effect of TSV

  • Conclusion

  • References

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    Index

    Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
    Copyright Year: 2012

    Wiley-IEEE Press eBook Chapters

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