Advanced Electronic Packaging

Cover Image Copyright Year: 2006
Author(s): Richard K. Ulrich; William D. Brown
Book Type: Wiley-IEEE Press
Content Type : Books
Topics: Components, Circuits, Devices & Systems ;  Engineered Materials, Dielectrics & Plasmas ;  Fields, Waves & Electromagnetics
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Abstract

Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.

Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:

  • Packaging materials and applications
  • Modeling and simulations
  • Analytical techniques for materials
  • MEMS packaging
  • Fabrication technologies and package design
  • Reliability
  • Electrical, mechanical, and thermal considerations
  • Three-dimensional packaging

All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.

Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.

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      Frontmatter

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      The prelims comprise:

    • Half Title

    • IEEE Press Board Page

    • Title

    • Copyright

    • Contents

    • Preface to the Second Reprint Edition

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    Contributors

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    Acronyms

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    Introduction and Overview of Microelectronic Packaging

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    This chapter contains sections titled:

  • Introduction

  • Functions of an Electronic Package

  • Packaging Hierarchy

  • Brief History of Microelectronic Packaging Technology

  • Driving Forces on Packaging Technology

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Materials for Microelectronic Packaging

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Some Important Packaging Material Properties

  • Ceramics in Packaging

  • Polymers in Packaging

  • Metals in Packaging

  • Materials Used in High-density Interconnect Substrates

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Processing Technologies

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Thin-Film Deposition

  • Patterning

  • Metal-to-Metal Joining

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Organic Printed Circuit Board Materials and Processes

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Common Issues for All PCB Layer Constructions

  • PCB Process Flow

  • Dielectric Materials

  • Surface Finishes

  • Advanced PCB Structures

  • Specifications and Standards

  • Key Terms

  • This chapter contains sections titled:

  • References

  • Exercises

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    Ceramic Substrates

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Ceramics in Electronic Packaging

  • Electrical Properties of Ceramic Substrates

  • Mechanical Properties of Ceramic Substrates

  • Physical Properties of Ceramic Substrates

  • Design Rules

  • Thin Film on Ceramics

  • Thick Films on Ceramics

  • Low-Temperature Cofired Ceramics (LTCC)

  • HTCC Fabrication Process

  • High-Current Substrates

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Electrical Considerations, Modeling, and Simulation

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Fundamental Considerations

  • Signal Integrity and Modeling

  • Transmission Lines

  • Coupled Noise or Crosstalk

  • Power and Ground

  • Overall Packaged IC Models and Simulation

  • Time-Domain Reflectometry

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Thermal Considerations

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Heat Transfer Fundamentals

  • Air Cooling

  • Liquid Cooling

  • Advanced Cooling Methods

  • Computer-Aided Modeling

  • Summary

  • This chapter contains sections titled:

  • References

  • Appendix: Thermophysical Properties for Heat Transfer Calculations

  • Exercises

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    Mechanical Design Considerations

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Deformation and Strain

  • Stress

  • Constitutive Relations

  • Simplified Forms

  • Failure Theories

  • Analytical Determination of Stress

  • Numerical Formulations

  • Summary

  • This chapter contains sections titled:

  • References

  • Bibliography

  • Exercises

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    Discrete and Embedded Passive Devices

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Passives in Modern Electronic Systems

  • Definitions and Configurations of Passives

  • Film-Based Passives

  • Resistors

  • Capacitors

  • Inductors

  • Electrical Characteristics of Passives

  • Issues in Embedding Passives

  • Decoupling Capacitors

  • Future of Passives

  • This chapter contains sections titled:

  • References

  • Exercises

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    Electronic Package Assembly

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Facilities

  • Component Handling

  • Surface-Mount Technology (SMT) Assembly

  • Wafer Preparation

  • Die Attachment

  • Wirebonding

  • Flip-Chip

  • Package Sealing/Encapsulation/Coating

  • Package-Level Processes

  • State-of-the-Art Technologies

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Design Considerations

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Packaging and the Electronic System

  • Trade-Offs Among Packaging Functions

  • Trade-Off Design Example

  • Product Development Cycle

  • Design Concepts

  • PCB/MCM Board Design Process

  • Summary

  • This chapter contains sections titled:

  • References

  • Bibliography

  • Exercises

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    Radio Frequency and Microwave Packaging

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction and Background

  • Transmission Lines

  • High-Frequency Circuit Implementation

  • Lumped-Element Components

  • Distributed Components

  • Simulation and Circuit Layout

  • Measurement and Testing

  • Frequency-Domain Measurements

  • Time-Domain Measurements

  • Design Example

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Power Electronics Packaging

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Semiconductor Power Device Technology

  • Commercially Available Power Packages

  • Power Packaging Design Methodology

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Multichip and ThreeDimensional Packaging

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Packaging Hierarchy and Taxonomy

  • Three-Dimensional Systems

  • Options in Multichip Packaging

  • Emerging Trends in Density Scaling

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Packaging of MEMS and MOEMS: Challenges and a Case Study

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Introduction

  • Background

  • Challenges in Mems Integration

  • Packaging Considerations and Guidelines Related to the Digital Micromirror Device

  • Future Packaging Challenges

  • This chapter contains sections titled:

  • References

  • Exercises

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    Reliability Considerations

    Advanced Electronic Packaging
    Copyright Year: 2006

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    This chapter contains sections titled:

  • Introduction

  • Failure Mechanisms

  • Accelerated Testing

  • Reliability Metrology

  • Failure Statistics for Microelectronic Systems

  • Industrial Practice of Reliability Science for Microelectronics

  • This chapter contains sections titled:

  • Bibliography

  • Exercises

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    Cost Evaluation and Analysis

    Advanced Electronic Packaging
    Copyright Year: 2006

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    This chapter contains sections titled:

  • Introduction

  • Product Cost

  • Break-even Analysis

  • Learning Curve Relationships

  • Forecasting Models

  • Comparative Analysis

  • Sensitivity Analysis

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises

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    Analytical Techniques for Materials Characterization

    Advanced Electronic Packaging
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    This chapter contains sections titled:

  • Overview

  • X-Ray Diffraction

  • Raman Spectroscopy

  • Scanning Probe Microscopy

  • Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy

  • Confocal Microscopy

  • Auger Electron Spectroscopy

  • X-ray Photoelectron Spectroscopy

  • Secondary Ion Mass Spectrometry

  • This chapter contains sections titled:

  • References

  • Exercises

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    Index

    Advanced Electronic Packaging
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