Tiny physical defects inspection by optimized EBI methodology

An optimization of e beam inspection (EBI) new methodology is implemented to monitor the defective issues in semiconductor manufacturing. The benefits of optimized e beam inspection methodology not only can switch the care area among the inspection tools, but also minimize the inspection shots and the time consumption in EBI application. Inspect tiny physical defects with high throughput using EBI inspection become viable by adopting the new optimized inspection methodology.