Fast 3D tomography at package level by using Xe plasma focused ion beam

Xe plasma FIB offers the milling rate at least 50 times higher than common Ga FIB. This makes many failure analysis tasks much faster, or the analysed volume might increase, while keeping the analysis time. 3D tomography by FIB-SEM takes advantage of this; results at the increased volume are demonstrated. The solder bump with the diameter of 100 pm was analysed and 3D tomography was performed by slicing the bump by FIB and imaging the slices by SEM. The distinct material contrast of the slices on backscattered electron images allowed to perform 3D reconstruction with the sufficient resolution and to resolve the different materials in the bump and their interfaces clearly.