High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.