The Characterization of High Temperature Electronics for Future Aircraft Engine Digital Electronic Control Systems

The characterization of high temperature electronics is presented including high temperature effects, semiconductors and barrier metallizations. Design solutions and material selections for mitigation of high temperature effects are indicated. The following semiconductor materials are considered as future high temperature candidates:

- Silicon (Si)

- Gallium arsenide (GaAs)

- Gallium phosphide (GaP)

- Silicon carbide (SiC)

- Diamond like carbon (C)

This characterization was originally prepared in accordance with the USAF Future Advance Controls Technology Study (FACTS).