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Substrate noise analysis with compact digital noise injection and substrate models

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5 Author(s)
Makoto Nagata, ; Integrated Syst. Lab., Hiroshima Univ., Japan ; Murasaka, Y. ; Nishimori, Y. ; Morie, T.
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This paper presents a substrate noise analysis methodology that employs chip-level substrate modeling based on F-matrix computation and digital substrate-noise injection modeling with a time-series divided parasitic capacitance model for time-domain power-supply current estimation. System-level simulation models generated according to the methodology provide reliable substrate noise waveforms. Simulated waveforms for practical digital circuits on a 0.6-μm CMOS 4.5-mm square chip are consistent with measurements with 100-ps 100-μV resolution. Peak-to-peak substrate noise amplitudes for reduced-substrate noise as well as conventional designs show roughly an error of 10% compared with the measurements

Published in:

Design Automation Conference, 2002. Proceedings of ASP-DAC 2002. 7th Asia and South Pacific and the 15th International Conference on VLSI Design. Proceedings.

Date of Conference:

2002