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A study of advanced ALIVH(R) interconnection technology

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5 Author(s)
Ochi, S. ; Devices Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan ; Echigo, F. ; Nakamura, T. ; Tomita, Yoshihiro
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We have developed the advanced ALIVH interconnection technology using the new functional materials. The ALIVH (Any Layer Interstitial Via Hole) substrate was developed and introduced into the market in 1996. The ALIVH substrate is a multi layered organic substrate with interstitial via holes in any layers. This substrate has a higher density and performance. The ALIVH substrate is constituted with the key technologies of the non-woven aramid-epoxy prepreg as the insulator material, the via hole drilling process using CO2 laser and the interconnection technology using conductive copper paste. For the interconnection using the conductive paste, to compress the interstitial via hole and preserve its shape effectively is essential. We reported the interconnection technology mainly using aramid-epoxy prepreg in the previous papers. In addition, in order to realize the high performance of the PCBs, we have studied the interconnection technology using the new functional materials. As a result, by controlling the thickness of the resin layer and the viscosity of the resin, the electric interconnections were completed. Now, we are progressing with the ALIVH interconnection technology using the various functional materials in order to reply the several demands on electronic equipment. In this paper, we will introduce the interconnection technology of the advanced ALIVH substrate

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Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

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