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Minimum consumption wafer coating

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4 Author(s)
Curtis, A. ; Flip Chip Div., Kulicke & Soffa, Phoenix, AZ, USA ; Bisson, P. ; Hamel, C. ; Hughlett, E.

In the realm of spin coatings the method of using puddle dispense has been the preferred method to use. We will de-throne the puddle dispense king with a new method that is economical, fast and reliable. This method dispenses the coating material in a uniformly thin line from the outside edge of the substrate to the center using significantly less material, in the same or less cycle time as used for the puddle dispense. The reverse radial dispense method will be defined, characterized and optimized for a production worthy process using a standard photo definable polymer material

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference:

2002