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Reliability of electrically conductive adhesives

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2 Author(s)
Kudtarkar, S.A. ; Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA ; Morris, J.E.

This paper presents data on various ICA reliability tests on electro migration, galvanic corrosion and impact resistance. Ag-loaded ICA samples are prepared with both Ag and Cu metallization pads. Some of these samples are then cured with and with out pre heating. These samples are then successively dropped from heights between one and six feet. Drop test performance is affected by the curing profile detail. Some samples are also subjected to 85/85 humidity tests to study electromigration and galvanic corrosion. Copper and silver boards are used for this and their results are then compared

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference:

2002