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Evaluation of board level reliability of Pb-free PBGA solder joints

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2 Author(s)
S. -W. R. Lee ; Electron. Packaging Lab., Hong Kong Univ. of Sci. & Technol., Kowloon, China ; B. H. W. Lui

The present study is intended to evaluate the board level reliability of PBGA assemblies under thermal and mechanical loading. The main objective is to characterize the reliability of Pb-free solder joints with various assembly conditions. For the purpose of benchmarking, specimens with conventional Sn-Pb eutectic solder are tested in parallel as well. During the course of this study, a five-leg experiment is designed with various combinations of solder materials and peak reflow temperatures. The reliability tests include temperature cycling, three-point bending, and random vibration. It is found that the Pb-free solder joints have a much longer thermal fatigue life than the 63Sn-37Pb solder. Although there is no significant difference, the 63Sn-37Pb solder joints seem to perform slightly better than the Pb-free solder under the mechanical loading

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference: