By Topic

Electrolessly deposited films in microelectronics and ULSI

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
T. N. Khoperia ; E. Andronikashvili Inst. of Phys., Acad. of Sci., Tbilisi, Georgia

Our department started extensive investigation of electroless plating of metallic, dielectric and semiconducting materials with pure metals and alloys forty years ago in the former USSR. We widely introduced the developed technologies into aerospace engineering, microelectronics, radioelectronics, piezoengineering, computing engineering and instrument-making. The developed technologies of electroless metallization of various materials are widely used at the enterprises for mass production of quartz resonators and filters, monolithic piezoquartz filters, photomasks, piezoceramic devices for hydroacoustics and delay lines of color TV sets, ICs and semiconducting devices, ceramic microplates, precise microwire and film resistors, and other devices. As a result of application of these technologies, gold, silver and palladium have been adequately replaced by alloys of non-noble metals, the usage of toxic substances has been eliminated and the technology has been significantly simplified. A new competitive nanotechnology is presented and the mechanism of sensitization and activation is described in this paper

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference: