Cart (Loading....) | Create Account
Close category search window
 

RF performance of diamond MISFETs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Umezawa, H. ; CREST, Japan Sci. & Technol. Corp., Tokyo, Japan ; Taniuchi, H. ; Ishizaka, H. ; A-Firna, T.
more authors

A cutoff frequency (f/sub T/) of 11 GHz is realized in the hydrogen-terminated surface channel diamond metal-insulator-semiconductor field-effect transistor (MISFET) with 0.7 /spl mu/m gate length. This value is five times higher than that of 2 /spl mu/m gate metal-semiconductor (MES) FETs and the maximum value in diamond FETs at present. Utilizing CaF/sub 2/ as an insulator in the MIS structure, the gate-source capacitance is reduced to half that of the diamond MESFET because of the gate insulator capacitance being in series to the surface-channel capacitance. This FET also exhibits the highest f/sub max/ of 18 GHz and 15 dB of power gain at 2 GHz. The high-frequency equivalent circuits of diamond MISFET are deduced from the S-parameters obtained from RF measurement.

Published in:

Electron Device Letters, IEEE  (Volume:23 ,  Issue: 3 )

Date of Publication:

March 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.