Referenced Items are not available for this document.
In this paper, we discuss a new technology implemented with all single wafer process for 300 mm fab. Very aggressive cycle time reduction with high yield has been demonstrated (one-third cycle time of that of conventional fab) in single polysilicon triple metal 8M/4M low power SRAM. High performance devices with excellent reliability are also achieved.
Published in:
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Date of Conference: 2-5 Dec. 2001
- Page(s):
- 28.3.1 - 28.3.4
- Meeting Date :
- 02 Dec 2001-05 Dec 2001
- Print ISBN:
- 0-7803-7050-3
- INSPEC Accession Number:
- 7239023
- Conference Location :
- Washington, DC, USA
- Digital Object Identifier :
- 10.1109/IEDM.2001.979578
- Product Type:
- Conference Publications
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