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Interconnecting device opportunities for gigascale integration (GSI)

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10 Author(s)
Meindl, J.D. ; Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Venkatesan, R. ; Davis, J.A. ; Joyner, J.
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In recent years interconnecting devices have become primary limits on the performance, energy dissipation, signal integrity, and productivity of gigascale integration (GSI). Opportunities to address the interconnect problem include new materials and processes, reverse scaling, novel microarchitectures, three-dimensional integration, input/output interconnect enhancements, RF wireless interconnects and microphotonics.

Published in:

Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International

Date of Conference:

2-5 Dec. 2001

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