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Transient thermal impedance considerations in power semiconductor applications

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2 Author(s)
Hopkins, T. ; SGS-Thomson Microelectron., Phoenix, AZ, USA ; Tiziani, R.

Cost-effective thermal design in power switching applications must consider the effect of thermal impedance of the packaging. A test method is presented for determining the transient thermal impedance of a package. Empirical measurements of the thermal impedance of some standard plastic packages, showing the effective thermal impedance under pulsed conditions, are also given. As an example of a practical application of the data presented, an application for switching motor control is considered

Published in:

Automotive Power Electronics, 1989

Date of Conference:

28-29 Aug 1989

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