Close category search window
 

Multilayer package modeling using the multi-resolution time domain technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Bushyager, N. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Obatoyinbo, A. ; Tentzeris, M.M. ; Laskar, J.

The multi-resolution time domain technique is applied to the modeling of multilayer packaging structures. In particular, the performance of a multilayer balun is evaluated using MRTD and the results are compared to those obtained using the FDTD technique as well as a commercial simulator. The abilities of MRTD to handle complex structures and as nonuniform cells are highlighted.

Published in:
Antennas and Propagation Society International Symposium, 2001. IEEE  (Volume:4 )

Date of Conference: 8-13 July 2001

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.