By Topic

A de-coupled vibratory gyroscope using a mixed micro-machining technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Byeung-Leul Lee ; MEMS Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea ; Sang-Woo Lee ; Kyu-Dong Jung ; Joon-Hyock Choi
more authors

This paper presents the highly reliable and wafer level vacuum packaged vertical micro-gyroscope with decoupled vibrating structures. In order to increase the sensitivity by exact tuning the resonant modes without instability problem, we devised two torsion springs for sensing mode in addition to four driving springs attached to outer gimbal. For the fabrication of the proposed gyroscope with high aspect ratio and wafer level vacuum packaging, we used the mixed micro-machining process which has the merits of a conventional surface and bulk micro-machining process. The measured vacuum level of the fabricated gyroscope was about 100 mTorr and the driving and sensing mode frequencies were tuned in 5 Hz. The gyroscope has the sensitivity of 0.013 deg./sec and bandwidth of 60 Hz. The output non-linearity is below than 2% in +100 deg./sec full scale.

Published in:

Robotics and Automation, 2001. Proceedings 2001 ICRA. IEEE International Conference on  (Volume:4 )

Date of Conference: