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Analysis of the bounces on the power/ground plane structures by planar circuit model and APA-E algorithm

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3 Author(s)
Xiaoping Yang ; Shanghai Jiaotong Univ., China ; Zhengfan Li ; Junfa Mao

In this paper, a novel effective numerical algorithm for analysis of the bounces on the power/ground-plane structure in printed circuit board (PCB) or multichip modules (MCMs) is proposed, which is based upon planar circuit model combined with APA-E algorithm. Firstly, the planar circuit model is developed to simulate the power/ground bounces when switching current is added in the structure. Secondly, on the basis of the abstract Pade approximant and the extrapolation algorithm, the APA-E algorithm is proposed. The classical multivariable rational Pade approximant is also constructed for comparison. Compared with finite difference time domain (FDTD) method, the new algorithm can provide a very accurate approximant in time domain, only requires little storage and CPU time. At last, attaching the decoupling capacitors for reducing the bounces on lossy power/ground-plane structures is also analyzed with this method

Published in:

IEEE Transactions on Advanced Packaging  (Volume:24 ,  Issue: 2 )