Cart (Loading....) | Create Account
Close category search window
 

Using a pattern monitor wafer on an inspection tool for chamber recoveries

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Audette, D. ; IBM Corp., Essex Junction, VT, USA ; Triplett, M.

In the past, when a maintenance person wanted to recover a process chamber from either an FM issue or a wet strip, they would use a bare silicon wafer. This worked when line sizes were larger. Current technology has a need for better process chamber controls. Pattern monitors look to be the future in tool recovery for lowering defect density. The use of classification and failure analysis on pattern monitors gives us the ability to identify and locate smaller particles that would have never been found in the past

Published in:

Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI

Date of Conference:

2001

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.